Analysis of solder paste scooping with hierarchical point processes

Benedek, Csaba (2011) Analysis of solder paste scooping with hierarchical point processes. In: ICIP 2011. 18th IEEE international conference on image processing, 2011-09-11 - 2010-11-30, Brussels, Belgium.

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Item Type: Conference or Workshop Item (Paper)
Subjects: Q Science > QA Mathematics and Computer Science > QA75 Electronic computers. Computer science / számítástechnika, számítógéptudomány
Divisions: Distributed Events Analysis Research Laboratory
Depositing User: EPrints Admin
Date Deposited: 11 Dec 2012 16:29
Last Modified: 11 Feb 2014 09:22
URI: http://eprints.sztaki.hu/id/eprint/6149

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