Analysis of solder paste scooping with hierarchical point processes
Benedek, Csaba (2011) Analysis of solder paste scooping with hierarchical point processes. In: ICIP 2011. 18th IEEE international conference on image processing, 2011-09-11 - 2010-11-30, Brussels, Belgium.
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| Item Type: | Conference or Workshop Item (Paper) |
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| Subjects: | Q Science > QA Mathematics and Computer Science > QA75 Electronic computers. Computer science / számítástechnika, számítógéptudomány |
| Divisions: | Distributed Events Analysis Research Laboratory |
| Depositing User: | EPrints Admin |
| Date Deposited: | 11 Dec 2012 16:29 |
| Last Modified: | 11 Feb 2014 09:22 |
| URI: | https://eprints.sztaki.hu/id/eprint/6149 |
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